The Compact Model Coalition (CMC) brings academia and industry partners together in the development and standardization of compact models for semiconductor devices. For more than 30 years, the CMC has been instrumental in creating standardized and verified models for designers to use in their increasingly complex circuits for SPICE simulation.

The CMC is organizing the second edition of the International Compact Modeling Conference, cosponsored by IEEE EDS. It will focus uniquely on compact device models, their development, and broad application in the semiconductor industry. You are invited to participate in the evolution of these models, guiding model development to help circuit designers achieve the best circuit performance possible, and enabling foundries to leverage the strength of their device fabrication to the full extent.

Join world experts in design, process technology, and model development for a two-day in-person event to discuss state-of-the-art semiconductor device modeling, offering a rare opportunity to present and learn about this core element of circuit design and how to get the most from these global collaborations.

Authors of selected papers will be invited to submit an extended version of their work for possible publication in a Special Issue of the Journal of the Electron Devices Society (IEEE J-EDS).

  • You may indicate on the paper submission form if you would like your submission to be considered for this opportunity.
  • Note: if accepted for publication in IEEE J-EDS (which is an open-access journal), a discounted Article Processing Charge of $650 must be paid by the authors.
March 2, 2026

Hard Submission deadline

April 13, 2026

Acceptance Notification

May 10, 2026

Final version for Publication